Academic Burnout and Academic Achievement among Secondary School Students in Kenya

dc.contributor.authorOyoo, Syprine
dc.contributor.authorMwaura, Peter
dc.contributor.authorKinai, Theresia
dc.contributor.authorMutua, Josephine
dc.date.accessioned2022-10-14T09:17:27Z
dc.date.available2022-10-14T09:17:27Z
dc.date.issued2020-05
dc.description.abstract,e study examined the relationship between academic burnout and academic achievement among secondary school students in the Kenyan context. Data were collected from 714 form 4 students (equivalent to 12th graders) drawn from 31 public secondary schools. ,e Maslach Burnout Inventory Student Survey was used. Academic achievement was measured using students’ grades in end of term examinations. ,e results of the Pearson product moment correlation of coefficient revealed a significant inverse relationship between academic burnout and academic achievement (r (712) � −0.24, p < 0.01). Furthermore, regression analysis revealed that academic efficacy significantly predicted academic achievement (β � 0.18, p < 0.01). A key implication of the findings is that examination-oriented approach to learning be reduced to ease the pressure exerted on learners for good academic gradesen_US
dc.identifier.citationOyoo, S., Mwaura, P., Kinai, T., & Mutua, J. (2020). Academic burnout and academic achievement among secondary school students in Kenya. Education Research International, 2020.en_US
dc.identifier.urihttp://ir-library.ku.ac.ke/handle/123456789/24331
dc.language.isoenen_US
dc.publisherHindawi Education Research Internationalen_US
dc.titleAcademic Burnout and Academic Achievement among Secondary School Students in Kenyaen_US
dc.typeArticleen_US
Files
Original bundle
Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
Academic Burnout and Academic Achievement....pdf
Size:
1.17 MB
Format:
Adobe Portable Document Format
Description:
Full text Article
License bundle
Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed upon to submission
Description: